Development of non-adhesive type flexible copper clad laminate "UPISEL®-N"

Journal of Photopolymer Science and Technology

Volumn 16, Issue 2, 2003, Pages 233-236

  Yamaguchi, Hiroaki ^a  

^a UBE INDUSTRIES LTD   (Japan)

Author keywords

Copper clad laminate; Non adhesive; Polyimide

Indexed keywords

COPPER; POLYIMIDE;

ADHESION; ARTICLE; FILM; FOIL; HEAT; HEAT TOLERANCE; HIGH TEMPERATURE PROCEDURES; PHYSICAL PARAMETERS; RELIABILITY; SURFACE PROPERTY;

EID: 0038506906     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.16.233     Document Type: Article

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