Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite

Journal of Materials Processing Technology

Volumn 201, Issue 1-3, 2008, Pages 746-750

  Li, L ^a   Kim, S M ^a   Song, S H ^a   Ku, T W ^a   Song, W J ^a   Kim, J ^a   Chong, M K ^b   Park, J W ^b   Kang, B S ^a  

^a Pusan National University   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

Bending stiffness; Finite element model; Multi layer; Printed circuit boards (PCBs); Woven fiber

Indexed keywords

BENDING (FORMING); FIBERS; FINITE ELEMENT METHOD; MULTILAYERS;

BENDING ANALYSIS; WOVEN FIBER COMPOSITE;

PRINTED CIRCUIT BOARDS;

EID: 41549160664     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.11.190     Document Type: Article

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