Finite element modelling of printed circuit boards (PCBs) for structural analysis

Circuit World

Volumn 26, Issue 3, 2000, Pages 24-29

  Miky, Lee ^a  

^a LG Electronics Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; FINITE ELEMENT METHOD; MANUFACTURE; MATHEMATICAL MODELS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT TESTING; RELIABILITY; SOLDERING; STRESSES;

FINITE ELEMENT MODELLING; REFLOW PROCESS; WARPAGE;

PRINTED CIRCUIT BOARDS;

EID: 0343353873     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. ASTM (1993), "Standard test method for shear properties of composite materials by the V-notched beam method", ASTM D5379/D5379M-93.
2. ASTM (1995), "Standard test method for tensile properties of polymer matrix composite materials", ASTM D3039/ D3039M-95a.
3. Lau, J.H. (1989), "A note on the calculation of thermal stresses in electronic packaging by finite element methods", ASME Journal of Electronic Packaging, Vol. 111, pp. 313-20.
4. Lee, M. and Jasiuk (1991), "Asymptotic expansions for the thermal stresses in bonded semi-infinite bi-material strips", ASME Journal of Electronic Packaging, Vol. 113, pp. 173-7.
5. MARC Analysis Software (1996), MARC Analysis Corporation, Palo Alto, CA.
6. Pao, Y. and Eisele, E. (1991), "Interfacial shear and peel stresses in multilayered thin stacks subjected to uniform thermal loading", ASME Journal of Electronic Packaging, Vol. 113, pp. 164-72.
7. Timoshenko, S. (1925), "Analysis of bi-metal thermostats", Journal of Optical Society of America, Vol. 11, pp. 595-600.