Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 558-573

  Wang, Yuqi ^a   Low, K H ^a   Pang, H L J ^a   Hoon, K H ^a   Che, F X ^a   Yong, Y S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY;

DROP-IMPACT ANALYSIS; HIGH-FREQUENCY APPLICATIONS; MULTI-LAYERED PRINTED CIRCUIT BOARDS; RELIABILITY SIMULATION;

PRINTED CIRCUIT BOARDS;

EID: 30844450123     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.05.007     Document Type: Article

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