Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards

Composites Science and Technology

Volumn 63, Issue 13, 2003, Pages 1971-1983

  Zhu, Qi ^a   Shrotriya, Pranav ^a   Sottos, Nancy R ^a   Geubelle, Philippe H ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Woven composites

Indexed keywords

DEFORMATION; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; VISCOELASTICITY;

WOVEN COMPOSITE SUBSTRATES;

COMPOSITE MATERIALS;

CREEP; FIBER REINFORCED COMPOSITE; REINFORCEMENT; THREE-DIMENSIONAL TEXTILE; VISCOELASTICITY; WOVEN FABRIC;

EID: 0041422544     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0266-3538(03)00171-4     Document Type: Article

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