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Volumn 6882, Issue , 2008, Pages

MEMS post-processing of MPW dies using BSOI carrier wafers

Author keywords

BSOI; CMOS; Die carrier; DRIE; MEMS

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTROPLATING; INTEGRATED CIRCUITS; PHOTORESISTS; SILICON ON INSULATOR TECHNOLOGY; SPIN COATING;

EID: 41149101558     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.763217     Document Type: Conference Paper
Times cited : (5)

References (10)
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  • 2
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    • Smith, J.H.1    Montague, S.2    Sniegowski, J.J.3    Murray, J.R.4    Manginell, R.P.5    McWhorter, P.J.6
  • 3
    • 0021640194 scopus 로고
    • Integrated silicon electromechanical vapor sensor
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    • Howe, R.T.1    Muller, R.S.2
  • 4
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    • A merged MEMS-CMOS process using silicon wafer bonding
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    • Parameswaran, L.1    Hsu, C.2    Schmidt, M.A.3
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    • Characterization of a time multiplexed inductively coupled plasma etcher
    • A A. Ayon, R. A. Braff, C. C. Lin, H. H. Sawin and M A Schmidt, "Characterization of a time multiplexed inductively coupled plasma etcher, " J. Electrochem. Soc 146 (1) 339-349 (1999).
    • (1999) J. Electrochem. Soc , vol.146 , Issue.1 , pp. 339-349
    • Ayon, A.A.1    Braff, R.A.2    Lin, C.C.3    Sawin, H.H.4    Schmidt, M.A.5
  • 8
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    • Influence of coil power on the etching characteristics in a high density plasma etcher
    • A A. Ayon, R. A. Braff, R. Bayt, H. H. Sawin and M A Schmidt, "Influence of coil power on the etching characteristics in a high density plasma etcher," J. Electrochem. Soc. 146 (7) 2730-2736 (1999).
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.