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Volumn , Issue , 2007, Pages 493-496

Tapered deep reactive ion etching: Method and characterization

Author keywords

Bosch process; DRIE; Etching; Taper

Indexed keywords

ACTUATORS; ANISOTROPIC ETCHING; ANISOTROPY; CLADDING (COATING); DRY ETCHING; ELECTRIC CONNECTORS; ETCHING; METALLIZING; METALS; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; PLASMA ETCHING; PROTECTIVE COATINGS; SENSORS; SILICON; STANDARDS; TRANSDUCERS;

EID: 41149092016     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300175     Document Type: Conference Paper
Times cited : (7)

References (11)
  • 1
    • 50149118539 scopus 로고    scopus 로고
    • F. Laermer and A. Schilp, German Pat. DE-4241045, 1994.
    • F. Laermer and A. Schilp, German Pat. DE-4241045, 1994.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.