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Volumn , Issue , 2007, Pages 493-496
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Tapered deep reactive ion etching: Method and characterization
a a a |
Author keywords
Bosch process; DRIE; Etching; Taper
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Indexed keywords
ACTUATORS;
ANISOTROPIC ETCHING;
ANISOTROPY;
CLADDING (COATING);
DRY ETCHING;
ELECTRIC CONNECTORS;
ETCHING;
METALLIZING;
METALS;
MICROSYSTEMS;
NONMETALS;
OPTICAL DESIGN;
PLASMA ETCHING;
PROTECTIVE COATINGS;
SENSORS;
SILICON;
STANDARDS;
TRANSDUCERS;
BOSCH PROCESS;
BOSCH PROCESSES;
DEEP ETCHING;
DEEP REACTIVE ION ETCHING;
DRIE;
ELECTRICAL CONNECTIONS;
INTERNATIONAL CONFERENCES;
LARGE RANGE;
MICROFABRICATION PROCESSES;
OUT-OF PLANE;
SIDE-WALL-ANGLE;
SINGLE ETCH;
SOLID-STATE SENSORS;
TAPER;
REACTIVE ION ETCHING;
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EID: 41149092016
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SENSOR.2007.4300175 Document Type: Conference Paper |
Times cited : (7)
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References (11)
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