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Volumn 38, Issue 4, 2008, Pages 457-468
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An investigation of copper interconnect deposition bath ageing by electrochemical impedance spectroscopy
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AIR LIQUIDE
(France)
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Author keywords
Ageing; Copper; Damascene process; Electrodeposition; Impedance; Microelectronics
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Indexed keywords
ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;
ELECTRODEPOSITION;
EQUIVALENT CIRCUITS;
MICROELECTRONICS;
COPPER INTERCONNECT PLATING BATHS;
DAMASCENE PROCESS;
COPPER;
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EID: 40849113532
PISSN: 0021891X
EISSN: None
Source Type: Journal
DOI: 10.1007/s10800-007-9459-1 Document Type: Article |
Times cited : (24)
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References (20)
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