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Volumn 572, Issue 2, 2004, Pages 367-375

Mechanism of copper deposition in a sulphate bath containing chlorides

Author keywords

Chloride; Copper; Electrochemistry; Electrocrystallization; Impedance

Indexed keywords

ACTIVATION ANALYSIS; CHLORINE COMPOUNDS; COMPUTATIONAL METHODS; CURRENT DENSITY; ELECTRIC IMPEDANCE; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; ION EXCHANGE; MASS TRANSFER; MATHEMATICAL MODELS; SULFURIC ACID;

EID: 4944262095     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2004.01.025     Document Type: Article
Times cited : (78)

References (16)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.