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Volumn 572, Issue 2, 2004, Pages 367-375
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Mechanism of copper deposition in a sulphate bath containing chlorides
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Author keywords
Chloride; Copper; Electrochemistry; Electrocrystallization; Impedance
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Indexed keywords
ACTIVATION ANALYSIS;
CHLORINE COMPOUNDS;
COMPUTATIONAL METHODS;
CURRENT DENSITY;
ELECTRIC IMPEDANCE;
ELECTROCHEMICAL ELECTRODES;
ELECTROCHEMISTRY;
ION EXCHANGE;
MASS TRANSFER;
MATHEMATICAL MODELS;
SULFURIC ACID;
CHLORIDE;
ELECTROCRYSTALLIZATION;
MASS TRANSPORT;
MICROELECTRONIC INTERCONNECTS;
COPPER;
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EID: 4944262095
PISSN: 15726657
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jelechem.2004.01.025 Document Type: Article |
Times cited : (78)
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References (16)
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