Plasma ash processing solutions for advanced interconnect technology

Thin Solid Films

Volumn 516, Issue 11, 2008, Pages 3558-3563

  Fuller, N C M ^a   Worsley, M A ^b   Tai, L ^c   Bent, S ^d   Labelle, C ^e   Arnold, J ^f   Dalton, T ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b STANFORD UNIVERSITY   (United States)

^c IBM   (United States)

^d Stanford University   (United States)

^e ADVANCED MICRO DEVICES   (United States)

^f IBM RESEARCH   (United States)

Author keywords

Downstream plasmas; Ion current; Plasma modification; Porous SiCOH dielectrics

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC CURRENTS; POROUS MATERIALS;

DOWNSTREAM PLASMAS; ION CURRENT; PLASMA MODIFICATION; POROUS SICOH DIELECTRICS;

LARGE SCALE SYSTEMS;

EID: 40649097547     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.08.071     Document Type: Article

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