Technical understanding of Resin-Coated-Copper (RCC) lamination processes for realization of reliable chip embedding technologies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 278-285

  Manessis, Dionysios ^a   Yen, Shiu Fang ^b   Ostmann, Andreas ^b   Aschenbrenner, Rolf ^b   Reichl, Herbert ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS INDUSTRY; EPOXY RESINS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; RELIABILITY ANALYSIS;

EMBEDDING TECHNOLOGIES; LAMINATION PROCESSES;

LAMINATING;

EID: 35348893145     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373810     Document Type: Conference Paper

References (6)

1. Aschenbrenner R., Ostmann A., NeumannA., and Reichl H., "Process Flow and Concept for Embedding Active Devices", Proc. Electronics Packaging Technology Conference '2004, Singapore, December 2004.
2. Ostmann, A. Neumann, J. Auersperg, C. Ghahremani, G. Sommer, Aschenbrenner R., and Reichl H., "Integration of Passive and Active Components into Build-Up Layers", Proc. Electronics Packaging Technology Conference 2002, Singapore, December, 2002.
3. A. Ostmann, A. Neumann, S. Wesen E. Jung, L. Böttcher and H. Reichl, "Realization of a Stackable Package Using Chip in Polymer Technology", Polytronic Conference, Zalaegerszeg, Hungary, June 23-26, 2002
4. Ostmann A., Kriechbaum A., De Baets J., and Kostner H., "Chip Embedding in Printed Circuit Board Production", Proc IMAPS Nordic, September 2005.
5. Jing Lin, Annette Teng, and Matthew M. F.Yuen, "A Fast, Low Cost Method To Check For Moisture In Epoxy Molding Compound", Proc. IEEE/CPMT Electronics Packaging Technology Conference 1998, pp. 359-361.
6. H. Li, L. Wang, C. P. Wong, "Study of a Controlled Thermally Degradable Epoxy Resin System for Electronic Packaging", Proc. Electronic Components and Techology Conference 2001, pp. 311-317.