Study of mixed flowing gas exposure of copper

Journal of the Electrochemical Society

Volumn 155, Issue 4, 2008, Pages

  Reid, M ^a,d   Punch, J ^a   Garfias Mesias, L F ^b,d   Shannon, K ^c   Belochapkine, S ^a   Tanner, D A ^a,d  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b CC Technologies USA   (United States)

^c SOUTHWEST RESEARCH INSTITUTE   (United States)

^d ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION PROTECTION; ENERGY DISPERSIVE X RAY ANALYSIS; FLOW OF GASES; FOCUSED ION BEAMS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

CORROSION LAYERS; CROSS SECTIONING; CUPROUS OXIDE; SECONDARY ION MASS SPECTROSCOPY;

COPPER;

EID: 40549122746     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2837834     Document Type: Article

References (26)

1. W. H. Abbott, IEEE Trans. Compon., Hybrids, Manuf. Technol. ITTEDR 0148-6411 10.1109/33.2959, 11, 22 (1988).
2. W. H. Abbott, IEEE Trans. Compon., Hybrids, Manuf. Technol. ITTEDR 0148-6411 10.1109/33.52847, 13, 40 (1990).
3. ASTM International, Standard Guide for Mixed Flowing Gas Tests for Electrical Contacts, ASTM B 845-97 (2003).
4. Telcordia Technologies, NEBS Requirements: Physical Protection, Generic Requirements GR-63-CORE, 2002. Method 5.5.2.
5. R. J. Geckle and R. S. Mroczkowski, IEEE Trans. Compon., Hybrids, Manuf. Technol. ITTEDR 0148-6411 10.1109/33.76526, 14, 162 (1991).
6. D. C. Abbott, IEEE Trans. Compon., Packag., Manuf. Technol., Part C 22, 99 (1999). 1521-3331
7. R. Martens and M. Pecht, J. Mater. Sci. Mater. Electron., 11, 209 (2000). 0957-4522
8. R. Martens and M. G. Pecht, IEEE Trans. Adv. Packag., 23, 561 (2000). 1521-3323
9. C. Hillman, B. Castillo, and M. Pecht, Microelectron. Reliab., 43, 635 (2003). 0026-2714
10. P. Zhao and M. Pecht, Microelectron. Reliab. MCRLAS 0026-2714 10.1016/S0026-2714(03)00064-7, 43, 775 (2003).
11. P. Zhao and M. Pecht, IEEE Trans. Device Mater. Reliab. ITDMA2 1530-4388 10.1109/TDMR.2005.846981, 5, 268 (2005).
12. T. T. M. Tran, C. Fiaud, and E. M. M. Sutter, Corros. Sci. CRRSAA 0010-938X 10.1016/j.corsci.2004.08.019, 47, 1724 (2005).
13. M. Reid, J. Punch, C. Ryan, L. F. Garfias, S. Belochapkine, J. P. Franey, G. E. Derkits, and W. D. Reents, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2436612, 154, C209 (2007).
14. W. E. Campbell and U. B. Thomas, Trans. ECS, 76, 303 (1939).
15. R. H. Lambert and D. J. Trevoy, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2428738, 105, 18 (1958).
16. B. I. Rickett and. J. H. Payer, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2048403, 142, 3713 (1995).
17. S. J. Krumbien, B. Newell, and V. Pascucci, J. Test. Eval., 11, 357 (1989). 0090-3973
18. S. Nakayama, T. Kaji, M. Shibata, T. Notoya, and T. Osakai, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2364837, 154, C1 (2007).
19. S. K. Chawla, B. I. Rickett, N. Sankarraman, and J. H. Payer, Corros. Sci. CRRSAA 0010-938X 10.1016/0010-938X(92)90038-5, 33, 1617 (1992).
20. K. Nassau, A. E. Miller, and T. E. Graedel, Corros. Sci. CRRSAA 0010-938X 10.1016/0010-938X(87)90052-7, 27, 703 (1987).
21. M. Watanabe, M. Tomita, and T. Ichino, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1418377, 148, B522 (2001).
22. M. Watanabe, Y. Higashi, and T. Ichino, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1535203, 150, B37 (2003).
23. R. L. Opila, Corros. Sci. CRRSAA 0010-938X 10.1016/0010-938X(87)90050-3, 27, 685 (1987).
24. J. H. Payer, G. Ball, B. I. Rickett, and H. S. Kim, Mater. Sci. Eng., A198, 91 (1995). 0025-5416
25. M. Lenglet, J. Lopitaux, C. Leygraf, I. Odnevall, M. Carballeira, J. C. Noualhaguet, J. Guinement, J. Gautier, and J. Boissel, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2048400, 142, 3690 (1995).
26. J. P. Franey and M. E. Davis, Corros. Sci. CRRSAA 0010-938X 10.1016/0010-938X(87)90048-5, 27, 659 (1987).