Mixed flowing gas studies of creep corrosion on plastic encapsulated microcircuit packages with noble metal pre-plated leadframes

IEEE Transactions on Device and Materials Reliability

Volumn 5, Issue 2, 2005, Pages 268-276

  Zhao, Ping ^a   Pecht, Michael ^a,b,c  

^a UNIVERSITY OF MARYLAND   (United States)

^b Microelectronics Reliability ^*

^c IEEE

Author keywords

Corrosion; Creep corrosion; Mixed flowing gas (MFG) test; Noble metal pre plated leadframe

Indexed keywords

COATING TECHNIQUES; CRACKS; CREEP; ELECTROPLATING; ENCAPSULATION; ENERGY DISPERSIVE SPECTROSCOPY; INSULATION; LEAD; PLASTICS MOLDING; RELIABILITY; SURFACE CLEANING; SURFACE ROUGHNESS;

MICROCIRCUIT PACKAGES; MIXED FLOWING GAS (MFG); NOBLE METAL PRE-PLATED LEADFRAME; PRINTED WIRING BOARD (PWB);

CORROSION;

EID: 23844550308     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2005.846981     Document Type: Conference Paper

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