Nonlinear dynamic analysis of surface mount interconnects: Part II—Applications

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 1, 1999, Pages 12-17

  Basaran, C ^a   Chandaroy, R ^b  

^a UNIVERSITY AT BUFFALO   (United States)

^b HKS ABAQUS Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD; MATHEMATICAL MODELS; MICROELECTRONICS; SERVICE LIFE; SOLDERED JOINTS; STRESSES; THERMAL EFFECTS; TIN;

SURFACE MOUNT INTERCONNECTS;

SURFACE MOUNT TECHNOLOGY;

EID: 0033097102     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792654     Document Type: Article

References (9)

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