Effect of (Au, Ni)Sn4 evolution on Sn-37Pb/ENIG solder joint reliability under isothermal and temperature-cycled conditions

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 1, 2007, Pages 32-41

  Davis, J A ^a   Bozack, M J ^b   Evans, J L ^b,c  

^a Lear Corporation   (United States)

^b AUBURN UNIVERSITY   (United States)

^c AUBURN UNIVERSITY   (United States)

Author keywords

Ball grid array (BGA); ENIG; Failure mode; Ni Au; Reliability; Solder joint

Indexed keywords

BALL GRID ARRAYS; CRACK PROPAGATION; FAILURE MODES; INTERMETALLICS; RELIABILITY ANALYSIS; THERMAL AGING; THERMAL CYCLING; THERMAL EFFECTS;

FAILURE MECHANISM; INTERFACIAL CRACKING; INTERFACIAL SMOOTHNESS;

SOLDERED JOINTS;

EID: 34147121964     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.892065     Document Type: Article

References (26)

1. J. Glazer, P. Kramer, and J. W. Morris, Jr., in Proc. Surface Mount Int. Conf., 1991, vol. 1.2, pp. 629-639.
2. S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith, and M. J. Bozack, IEEE Trans. Electron. Packag. Manufact., vol. 25, no. 3, pp. 168-183, Jul. 2002.
3. E. K. Ohriner, "Intermetallic formation in soldered copper-based alloys at 150 °C to 250 °C," Welding J.: Res. Suppl., pp. 191-202s, Jul. 1987.
4. R. R. Chromik, "The Thermodynamics and Kinetics of Solid State Reactions in the Pd-Sn System," M.S. thesis, SUNY, Binghamton, 1996.
5. R. R. Chromik and Z. Mei, "The Thermodynamics and Kinetics of Solid State Reactions in the Pd-Sn System," M.S. thesis, SUNY, Binghamton, 1996.
6. P. A. Kramer, J. Glazer, and J. W. Morris, Jr., "The effect of low Au concentrations on the creep of eutectic Sn-lead joints," Metall. Mater. Trans. A, vol. 25, p. 1249, 1994.
7. P. A. Kramer, J. Glazer, J. W. Morris, Jr., and E. K. Ohriner, "The effect of low Au concentrations on the creep of eutectic Sn-lead joints," Metall. Mater. Trans. A, vol. 25, p. 1249, 1994.
8. Z. Mei, A. Eslambolchi, and P. Johnson, in Proc. 48th Electron. Comp. Technol. Conf., Piscataway, NJ, 1998, pp. 952-961.
9. A. M. Minorand J. W. Morris, Jr., "Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging," Metall. Mater. Trans. A, vol. 31A, pp. 798-800, Mar. 2000.
10. 4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization," J. Electron. Mater., vol. 29, p. 1171, 2000.
11. A. Zribi, R. Chromik, R. Prethus, J. Clum. L. Zavalij, and E. Cotts, "Effect of Au-intermetallic compounds on the mechanical reliability of Sn-Pb/Au-Ni-Cu joints," in Proc. InterPACK Conf., Adv. Electron. Packag., 1999, vol. 26, p. 1573.
12. Z. Mei, A. Eslambolchi, and P. Johnson, in Proc. 48th Electron. Comp. Technol. Conf., Piscataway, NJ, 1998, pp. 952-961, IEEE.
13. K. Banerji and R. Darveaux, in Proc. TMS-AIME 1st Int. Conf. Microstruct. Mech. Prop. Aging Mater., 1992, p. 431.
14. K. Banerji and R. Darveaux, in Proc. TMS-AIME 1st Int. Conf. Microstruct. Mech. Prop. Aging Mater., 1992, p. 431.
15. C. E. Ho, Y. M. Chen, and C. R. Kao, "Reaction kinetics of solder balls with pads in BGA packages during reflow soldering," J. Electron. Mater., vol. 28, p. 1231, 1999.
16. 1 in solder joints of ball-grid-array packages with the Au/Ni surface finish," J. Electron. Mater., vol. 29, p. 1175, 2000.
17. J. L. Evans, J. Davis, E. Crain, J. R. Tbompsom, and P. Seto, "Component reliability on metal-backed substrates for harsh automotive environments," SMTA J., vol. 17, no. 4, pp. 24-33, Oct. 2004.
18. D. A. Gedcke, L. G. Byars, and W. H. Hardy, Scanning Electron Micros vol. III, p. 981, 1982.
19. D. A. Gedcke, L. G. Byars, W. H. Hardy, and A. Zribi, Scanning Electron Micros, vol. III, p. 981, 1982.
20. K. Y. Lee, M. Li, R. D. Olsen, and W. T. Chen, "Microstructure joint strength and failure mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packages," in Proc. IEEE Electron. Comp. Technol. Conf., 2001, pp. 478-485.
21. 4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization," J. Electron. Mater., vol. 29, p. 1170, 2000.
22. C. E. Ho, W. T. Chen, and C. R. Kao, "Interactions between solder and metallization during long-term aging of advanced microelectronic packages," J. Electron. Mater., vol. 30, no. 4, p. 379, 2001.
23. 4 and reducing the consumption of Ni metallization in solder joints," J. Electron. Mater., vol. 31, p. 1264, 2002.
24. 4 and reducing the consumption of Ni metallization in solder joints," J. Electron. Mater., vol. 31, p. 1264, 2002.
25. A. Zribi, R. K. Kinyanjui, W. Varano, and E. J. Cotts, "Inhibiting Growth of Au-Ni-Sn Ternary Compounds at the Interfaces of Pb-Based and Pb-Free Solder Joints," in Proc. SMTA Int. Conf., Sep. 2002, [CD ROM].
26. Y. C. Chan, P. L. Tu, A. C. K. So, and J. K. L. Lai, "Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 20, no. 4, pp. 463-469, Nov. 1997.