The effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates

Materials Letters

Volumn 62, Issue 12-13, 2008, Pages 1867-1870

  Kim, Kyung Seob ^a   Kim, Jin Hyeok ^b   Han, Sung Won ^c  

^a Yeojoo Institute of Technology   (South Korea)

^b Chonnam National University   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

Diffusion; Electron microscopy; Intermetallic alloys and compounds; Lead free finish; Microstructure; Whisker

Indexed keywords

ATMOSPHERIC HUMIDITY; CRYSTAL WHISKERS; ELECTRON MICROSCOPY; MICROSTRUCTURE;

LEAD-FREE FINISH; NODULE-SHAPED WHISKERS;

INTERMETALLICS;

EID: 39149100692     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2007.10.027     Document Type: Article

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