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The International Technology Roadmap for Semiconductors
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Floyd, B. A.; Hung, Chin-Ming and O, K.K.; Intra-Chip Wireless Interconnect for Clock Distribution Implemented With Integrated Antennas, Receivers, and Transmitters, IEEE Journal of Solid-State Circuits, 37, no.5, pp 543-552, May 2002.
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Design of wireless onwafer submicron characterization system
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Miura, N.; Mizoguchi, D.; Inoue, M.; Sakurai, T.; Kuroda, T.; A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package, IEEE Journal of Solid-State Circuits, vol41, no. 1, pp. 23-34, Jan 2006.
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Miura, N.; Mizoguchi, D.; Inoue, M.; Sakurai, T.; Kuroda, T.; "A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package," IEEE Journal of Solid-State Circuits, vol41, no. 1, pp. 23-34, Jan 2006.
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New Embedded Core Testing for System-on-Chips and System-in-Packages
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Wang, Y.; and Margala, M; "New Embedded Core Testing for System-on-Chips and System-in-Packages," accepted for publication in Proceedings of CCECE 2006.
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Design of a Wireless Test Control Network with Radio-on-Chip Technology for Nanometer System-on-Chips, accepted to be published in IEEE Transactions on Computer-Aided Design of Integrated
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Zhao, D; Upadhyaya, S.; Margala, M.; "Design of a Wireless Test Control Network with Radio-on-Chip Technology for Nanometer System-on-Chips, " accepted to be published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
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Microstrip Antenna Technology
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On the Effect of Substrate Thickness and Permittivity on Printed Circuit Dipole Properties
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Katehi, P. B.; Alexopoulos, N.G.; "On the Effect of Substrate Thickness and Permittivity on Printed Circuit Dipole Properties," IEEE Transactions on Antennas and Propagation, vol. AP-31, no. 1, pp. 34-39, January 1983.
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