Surface tension and wetting behaviour of molten Cu-Sn alloys

Journal of Alloys and Compounds

Volumn 452, Issue 1, 2008, Pages 161-166

  Amore, Stefano ^a,b   Ricci, Enrica ^a   Lanata, Tiziana ^a,b   Novakovic, Rada ^a  

^a CNR   (Italy)

^b UNIVERSITY OF GENOA   (Italy)

Author keywords

Lead free solders; Surface tension; Wetting

Indexed keywords

CONTACT ANGLE; COPPER ALLOYS; SOLDERING ALLOYS; SURFACE TENSION; TIN ALLOYS; WETTING;

INTERFACIAL PROPERTIES; LEAD-FREE SOLDERS; QUASI-CHEMICAL APPROXIMATION; SESSILE DROP METHOD; SOLDERING MATERIALS;

LIQUID METALS;

EID: 38949145023     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.01.178     Document Type: Article

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