Effect of temperature on the surface properties of Cu-Sn liquid alloys

Journal of Alloys and Compounds

Volumn 314, Issue 1-2, 2001, Pages 193-197

  Prasad, L C ^a   Mikula, A ^a  

^a UNIVERSITY OF VIENNA   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; DISSOCIATION; LIQUID METALS; MATHEMATICAL MODELS; STATISTICAL MECHANICS; SURFACE TENSION; THERMAL EFFECTS; THERMODYNAMICS;

EQUI-ATOMIC COMPOSITION;

COPPER ALLOYS;

EID: 0035120936     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-8388(00)01229-9     Document Type: Article

References (15)

1. Wang D.J., Lannuti J.J. J. Met. Sci. 30:1995;3171.
2. Prasad L.C., Mikula A. J. Alloys Comps. 282:1999;279.
3. Prasad L.C., Mikula A. High Temp. Mater. Processes. 19:(1):2000;61.
4. Kapor R.R., Eager T.W. Met. Trans. 20B:1989;919.
5. Reynolds H.L., Morris J.W. Jr. J. Electronic Mater. 24:(10):1995;1429.
6. Prasad L.C., Singh R.N. Re. Phys. Rev. B44:(24):1991;13768.
7. Prasad L.C., Singh R.N., Singh G.P., Singh V.N. J. Phys. Chem. (Am. Chem. Soc.). 102:1998;921.
8. Prasad L.C., Chatterjee S.K., Singh V.N. Phys. B. 217:1996;285.
9. Prasad L.C., Singh R.N., Singh V.N., Chatterjee S.K. Phys. B. 215:1995;225.
10. Prasad L.C., Mikula A. J. Alloys Comp. 299:2000;175.
11. B.J. Keene, The surface tension of tin and its alloys with particular reference to solders, NPL report, DMM (A) 1995.
12. Laty P., Joud J.C., Desre P. Surf. Sci. 60:1976;109.
13. Raue G., Metzger G., Sauerwald H.C. Metall. 20:(10):1960;1040.
14. Kawai Y., Kishimoto M., Tsuru H. Nippon Kinz. Gakk. 37:(6):1973;668.
15. Sauerwald F. Z. Anorg. Chem. 162:1927;301.