Simulations of process-induced warpage during IC encapsulation process

Journal of Electronic Packaging

Volumn 129, Issue 3, 2007, Pages 307-315

  Teng, Shiang Yu ^a   Hwang, Sheng Jye ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Cure induced shrinkage; IC package; P V T C equation; Warpage

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; ENCAPSULATION; OPTIMIZATION; PROBLEM SOLVING; SHRINKAGE;

CURE INDUCED SHRINKAGE; THERMAL INDUCED SHRINKAGE; WARPAGE ANALYSIS;

DIGITAL INTEGRATED CIRCUITS;

EID: 38749145161     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2753936     Document Type: Article

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