Cure shrinkage analysis of epoxy molding compound

Polymer Engineering and Science

Volumn 41, Issue 8, 2001, Pages 1373-1379

  Oota, Ken ^a   Saka, Masumi ^b  

^a Kiyohara Industrial Park ^*  (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DENSITY (SPECIFIC GRAVITY); ELECTRONICS PACKAGING; ENCAPSULATION; INTEGRATED CIRCUITS; PLASTICS MOLDING; SHRINKAGE; THERMAL EFFECTS;

CURE SHRINKAGE ANALYSIS; EPOXY MOLDING COMPOUND; REACTION RATIO; THERMAL SHRINKAGE; WARPAGE;

EPOXY RESINS;

EID: 0035417740     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10837     Document Type: Article

References (5)