Four-laser bending beam measurements and FEM modeling of underfill induced wafer warpage

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 747-753

  Zhang, Zhuqing ^a   Fan, Lianhua ^a   Sitaraman, Suresh K ^a,b   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FOUR-LASER BENDING BEAM SYSTEMS; UNDERFILL CURING; WAFER LEVEL PACKAGING (WLP); WAFER WARPAGE;

FINITE ELEMENT METHOD; FLIP CHIP DEVICES; LASER BEAM EFFECTS; PLASTIC FILMS; THERMAL CYCLING; THICK FILMS;

CHIP SCALE PACKAGES;

EID: 10444241809     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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