Study of warpage due to P-V-T-C relation of EMC in IC packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 291-295

  Hong, Li Ching ^a   Hwang, Sheng Jye ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CURING; ENCAPSULATION; EPOXY RESINS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; PRESSURE; RESIDUAL STRESSES; STRAIN; TEMPERATURE; VOLUME MEASUREMENT;

EPOXY MOLDING COMPOUNDS; MOLD FLOW ANALYSIS; PRESSURE VOLUME TEMPERATURE CURE RELATION; STRESS STRAIN RELATIONSHIP; WARPAGE;

ELECTRONICS PACKAGING;

EID: 3242784825     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828579     Document Type: Article

References (12)

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