P-V-T-C equation for epoxy molding compound

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 112-117

  Hwang, Sheng Jye ^a   Chang, Yi San ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Isobaric; Isothermal; Pressure volume temperature cure (P V T C) equation; Volume shrinkage; Warpage

Indexed keywords

COMPUTER SIMULATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DILATOMETERS; EPOXY RESINS; MATHEMATICAL MODELS; PRESSURE EFFECTS; SHRINKAGE; THERMAL EFFECTS; THERMOSETS; VOLUME MEASUREMENT;

EPOXY MOLDING COMPOUND; ISOBARIC STATES; ISOTHERMAL STATE; MOLD FILLING SIMULATION; PRESSURE-VOLUME-TEMPERATURE-CURE EQUATION;

SHEET MOLDING COMPOUNDS;

EID: 33644806428     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853171     Document Type: Article

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