Advancing polymer process understanding in package and board applications through molecular modeling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1354-1359

  Iwamoto, N E ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; MATHEMATICAL MODELS; MOLECULAR STRUCTURE; PLASTICS APPLICATIONS; PRINTED CIRCUIT BOARDS;

MOLECULAR MODELING; POLYMER CHAINS; STRESS CYCLING;

ELECTRONICS PACKAGING;

EID: 0034478828     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)