Advancing materials using interfacial process and reliability simulations on the molecular level

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 14-17

  Iwamoto, N E ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; HYSTERESIS; INTERFACIAL ENERGY; MATHEMATICAL MODELS; MICROELECTRONIC PROCESSING; MOLECULAR STRUCTURE; STRAIN; STRESSES; WETTING;

BLEED; RELIABILITY MOLECULAR MODELING;

ELECTRONICS PACKAGING;

EID: 0033699716     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)