Property trend analysis and simulations of adhesive formulation effects in the microelectronics packaging industry using molecular modeling

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1241-1246

  Iwamoto, N ^a   Pedigo, J ^a  

^a Johnson Matthey Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FORECASTING; MICROELECTRONICS; MOLECULAR MODELING; NETWORK COMPONENTS; ADHESIVES; COMPUTER SIMULATION; MICROELECTRONIC PROCESSING; SUBSTRATES; WETTING;

ADHESIVE FORMULATION; ADHESIVE MATERIALS; JOHNSON MATTHEY; MANUFACTURABILITY; MICROELECTRONICS PACKAGING; PHYSICAL EFFECTS; TREND ANALYSIS; WETTING PROPERTY;

ADHESIVES; ELECTRONICS PACKAGING;

MICROELECTRONICS PACKAGING INDUSTRY; MOLECULAR MODELING;

EID: 0031625556     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678894     Document Type: Conference Paper

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