Applying polymer process studies using molecular modeling

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 182-187

  Iwamoto, N E ^a  

^a HONEYWELL   (United States)

Author keywords

Additives; Adhesives; Copper; Microelectronics; Packaging; Polymers; Predictive models; Printed circuits; Resins; Thermal stresses

Indexed keywords

ADDITIVES; ADHESIVES; COATINGS; COPPER; CURING; JOINING; MANUFACTURE; MICROELECTRONICS; PACKAGING; POLYMERS; PRINTED CIRCUITS; RECONFIGURABLE HARDWARE; RESINS; THERMAL CYCLING; THERMAL STRESS;

DEVELOPMENT SCENARIOS; EXPERIMENTAL EVIDENCE; INORGANIC COMPONENTS; INTERFACIAL MECHANISM; PACKAGING INDUSTRY; PERFORMANCE ISSUES; PREDICTIVE MODELS; RESIN COATED COPPER;

PLASTIC COATINGS;

EID: 84952327544     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860595     Document Type: Conference Paper

References (7)

1. Previous work formerly performed within Johnson Matthey Electronics.
2. N.E. Iwamoto, M. Nakagawa, G. Mustoe, "Predicting Material Trends Using Discrete Newtonian Modeling Techniques", Nepcon West '99 Proceedings V. III, pp. 1689-1698; presented Nepcon West, Anaheim, CA, February 24, 1999.
3. N. Iwamoto, M. Li, S.J. McCaffrey, M. Nakagawa, G. Mustoe, "Molecular Dynamics and Discrete Element Modeling Studies of Underfill", 1998 International Journal of Microcircuits and Electronic Packaging, v. 21 No. 4, Fourth Quarter 1998, pp. 322-328.
4. nd International Symposium on Microelectronics; Chicago, Ill, Oct. 1999.
5. Molecular Simulations, Inc., San Diego, CA.
6. J. Pedigo, N. Iwamoto, A. Grieve, C. Zhou; "Viafill Formulations which are Electrically and/or Thermally or Nonconductive", patent pending.
7. J. Pedigo, N. Iwamoto, C. Zhou; "Advancing Viafill Materials for Next Generation Interconnection Technology" submitted to HDI magazine.