-
2
-
-
0001044176
-
Neural networks and their applications
-
Bishop C.M. Neural networks and their applications. Review of Scientific Instrumentation 65 6 (1994) 1803-1832
-
(1994)
Review of Scientific Instrumentation
, vol.65
, Issue.6
, pp. 1803-1832
-
-
Bishop, C.M.1
-
3
-
-
0025433611
-
The use and evaluation of yield models in integrated circuit manufacturing
-
Cunningham J.A. The use and evaluation of yield models in integrated circuit manufacturing. IEEE Transactions on Semiconductor Manufacturing 3 2 (1990) 60-71
-
(1990)
IEEE Transactions on Semiconductor Manufacturing
, vol.3
, Issue.2
, pp. 60-71
-
-
Cunningham, J.A.1
-
4
-
-
21644441583
-
-
Dupret, Y., & Kielbasa, R. (2004). Modeling semiconductor manufacturing yield by test data and partial least squares. In Proceedings of 16th International Conference on Microelectronics (pp. 404-407). France.
-
Dupret, Y., & Kielbasa, R. (2004). Modeling semiconductor manufacturing yield by test data and partial least squares. In Proceedings of 16th International Conference on Microelectronics (pp. 404-407). France.
-
-
-
-
5
-
-
0003710566
-
-
Prentice Hall, Englewood CLiffs, NJ
-
Fausett L. Fundamentals of neural networks architectures, algorithms, and applications (1994), Prentice Hall, Englewood CLiffs, NJ
-
(1994)
Fundamentals of neural networks architectures, algorithms, and applications
-
-
Fausett, L.1
-
7
-
-
0031199871
-
Model-free estimation of defect clustering in integrated circuit fabrication
-
Friedman D.J., Hansen M.H., Nair V.N., and James D.A. Model-free estimation of defect clustering in integrated circuit fabrication. IEEE Transactions on Semiconductor Manufacturing 10 3 (1997) 344-359
-
(1997)
IEEE Transactions on Semiconductor Manufacturing
, vol.10
, Issue.3
, pp. 344-359
-
-
Friedman, D.J.1
Hansen, M.H.2
Nair, V.N.3
James, D.A.4
-
9
-
-
24144458265
-
Study of area scaling effect on integrated circuit reliability based on yield models
-
Hong C., Milor L., Choi M., and Lin T. Study of area scaling effect on integrated circuit reliability based on yield models. Microelectronics Reliability 45 9-11 (2005) 1305-1310
-
(2005)
Microelectronics Reliability
, vol.45
, Issue.9-11
, pp. 1305-1310
-
-
Hong, C.1
Milor, L.2
Choi, M.3
Lin, T.4
-
10
-
-
0025627940
-
Universal approximation of an unknown mapping and its derivatives using multilayer feedforward networks
-
Hornick K., Stinchcombe M., and White H. Universal approximation of an unknown mapping and its derivatives using multilayer feedforward networks. Neural Networks 3 5 (1990) 551-560
-
(1990)
Neural Networks
, vol.3
, Issue.5
, pp. 551-560
-
-
Hornick, K.1
Stinchcombe, M.2
White, H.3
-
11
-
-
0032668231
-
A simulation-based semiconductor chip yield model incorporating a new defect cluster index
-
Jun C.H., Hong Y., Kim S.Y., Park K.S., and Park H. A simulation-based semiconductor chip yield model incorporating a new defect cluster index. Microelectronics Reliability 39 4 (1999) 451-456
-
(1999)
Microelectronics Reliability
, vol.39
, Issue.4
, pp. 451-456
-
-
Jun, C.H.1
Hong, Y.2
Kim, S.Y.3
Park, K.S.4
Park, H.5
-
12
-
-
27844509133
-
A theoretical yield model for assembly process of area array solder interconnect packages with experimental verification
-
Kim C., and Baldwin D.F. A theoretical yield model for assembly process of area array solder interconnect packages with experimental verification. IEEE Transactions on Electronics Packaging Manufacturing 28 4 (2005) 344-354
-
(2005)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.28
, Issue.4
, pp. 344-354
-
-
Kim, C.1
Baldwin, D.F.2
-
13
-
-
0035182907
-
-
Langford, R. E., Liou, J. J., & Raghavan, V. (2001). The application and validation of a new robust windowing method for the Poisson yield model. In Advanced Semiconductor Manufacturing Conference, IEEE/SEMI (pp. 157-160). Germany.
-
Langford, R. E., Liou, J. J., & Raghavan, V. (2001). The application and validation of a new robust windowing method for the Poisson yield model. In Advanced Semiconductor Manufacturing Conference, IEEE/SEMI (pp. 157-160). Germany.
-
-
-
-
14
-
-
0036540087
-
Statistical modeling of MOS devices for parametric yield prediction
-
9
-
Liou J.J., Zhang Q., McMacken J., Thomson J.R., Stiles K., and Layman P. Statistical modeling of MOS devices for parametric yield prediction. Microelectronics Reliability 42 4 (2002) 787-795 9
-
(2002)
Microelectronics Reliability
, vol.42
, Issue.4
, pp. 787-795
-
-
Liou, J.J.1
Zhang, Q.2
McMacken, J.3
Thomson, J.R.4
Stiles, K.5
Layman, P.6
-
15
-
-
0242410443
-
Predicting defect-tolerant yield in the embedded core context
-
Meyer F.J., and Park N. Predicting defect-tolerant yield in the embedded core context. IEEE Transactions on Computers 52 11 (2003) 1470-1479
-
(2003)
IEEE Transactions on Computers
, vol.52
, Issue.11
, pp. 1470-1479
-
-
Meyer, F.J.1
Park, N.2
-
17
-
-
0015423592
-
Analysis of yield of integrated circuits and a new expression of the yield
-
Okabe T., Nagata M., and Shimada S. Analysis of yield of integrated circuits and a new expression of the yield. Electrical Engineering in Japan 92 12 (1972) 135-141
-
(1972)
Electrical Engineering in Japan
, vol.92
, Issue.12
, pp. 135-141
-
-
Okabe, T.1
Nagata, M.2
Shimada, S.3
-
18
-
-
0001473437
-
On estimation of a probability density function and mode
-
Parzen E. On estimation of a probability density function and mode. The Annals of Mathematical Statistics 33 3 (1962) 1065-1076
-
(1962)
The Annals of Mathematical Statistics
, vol.33
, Issue.3
, pp. 1065-1076
-
-
Parzen, E.1
-
19
-
-
0031126244
-
Poisson mixture yield models for integrated circuits: A critical review
-
Raghavachari M., Srinivasan A., and Sullo P. Poisson mixture yield models for integrated circuits: A critical review. Microelectronics Reliability 37 4 (1997) 565-580
-
(1997)
Microelectronics Reliability
, vol.37
, Issue.4
, pp. 565-580
-
-
Raghavachari, M.1
Srinivasan, A.2
Sullo, P.3
-
20
-
-
0036869292
-
Multivariate statistical methods for modeling and analysis of wafer probe test data
-
Skinner K.R., Montgomery D.C., Runger G.C., Fowler J.W., McCarville D.R., Rhoads T.R., et al. Multivariate statistical methods for modeling and analysis of wafer probe test data. IEEE Transactions on Semiconductor Manufacturing 15 4 (2002) 523-530
-
(2002)
IEEE Transactions on Semiconductor Manufacturing
, vol.15
, Issue.4
, pp. 523-530
-
-
Skinner, K.R.1
Montgomery, D.C.2
Runger, G.C.3
Fowler, J.W.4
McCarville, D.R.5
Rhoads, T.R.6
-
21
-
-
0026254768
-
A general regression neural network
-
Specht D.F. A general regression neural network. IEEE Transactions Neural Networks 2 6 (1991) 568-576
-
(1991)
IEEE Transactions Neural Networks
, vol.2
, Issue.6
, pp. 568-576
-
-
Specht, D.F.1
-
23
-
-
0021782318
-
The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions
-
Stapper C.H. The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions. IBM Journal of Research Development 29 1 (1985) 87-97
-
(1985)
IBM Journal of Research Development
, vol.29
, Issue.1
, pp. 87-97
-
-
Stapper, C.H.1
-
26
-
-
0029304862
-
Integrated circuit yield management and yield analysis: Development and implementation
-
Stapper C.H., and Rosner R.J. Integrated circuit yield management and yield analysis: Development and implementation. IEEE Transactions on Semiconductor Manufacturing 8 2 (1995) 95-102
-
(1995)
IEEE Transactions on Semiconductor Manufacturing
, vol.8
, Issue.2
, pp. 95-102
-
-
Stapper, C.H.1
Rosner, R.J.2
-
28
-
-
0023602179
-
-
Widrow, B., Winter, R.G., & Baxter, R.A. (1987). Learning phenomena in layered neural networks. In Proceedings of the First IEEE International Conference on Neural Networks (pp. 411-429). San Diego.
-
Widrow, B., Winter, R.G., & Baxter, R.A. (1987). Learning phenomena in layered neural networks. In Proceedings of the First IEEE International Conference on Neural Networks (pp. 411-429). San Diego.
-
-
-
|