Thermal analysis of QFN packages using finite element Method

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 499-503

  Chang, Chia Lung ^a   Hsieh, Yow Yi ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; COMPUTER SOFTWARE; FINITE ELEMENT METHOD; HEAT LOSSES; HEAT RESISTANCE; HEAT TRANSFER; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY; THERMOANALYSIS; VELOCITY; VISCOSITY; WIND TUNNELS;

AIR CONVECTION; AIR DENSITY; HEAT GENERATION; QUAD FLAT NON-LEADED (QFN) PACKAGE;

COMPUTATIONAL FLUID DYNAMICS;

EID: 3843142736     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Lu, A. C. W. et al, "Electrical and Thermal Modelling of QFN Packages," IEEE Electronic Packaging Technology Conference, 2000, pp. 352-356.
2. Lau, John H, et al, Chip Scale Package, The McGraw-Hill Companies, Inc. (New York, 1999), pp. 71-86.
3. Lau, John H, et al, "Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package," Journal of Electronic Packaging, Vol. 119 (1997), pp. 208-212.
4. Lau John, et al, "Cooling Assessment and Distribution of Heat Dissipation of A Cavity Down Plastic Ball Grid Array Package-NuBGA," International Journal of Microcircuits and Electronic Packaging, Vol. 21, No.1 (1998), pp. 109-118.
5. Cote Kevin, et al, "Thermal Characterization of Multi-Die EGA Packages," Electronic Components and Technology Conference, 1998, pp. 70-75.
6. rd Edition, John Wiley & Sons (New York, 1996), pp. 323-387.
7. Ellison, Gordon N., Thermal Computations for Electronic Equipment, Robert E. Krieger Publishing Company (Malabar, Florida, 1989), pp. 25-71.
8. th Electronic Components and Technology Conference, 1995, pp. 1140-1151.
9. Burgos Juan et al, "Achieving Accurate Thermal Characterization Using a CFD Code - A case Study of Plastic Packages," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 15, No. 4 (1995), pp. 732-738.
10. Cho Eric, et al, "Thermal Characterization of Cavity-Down TBGA Package with Flotherm Simulation," Sixteenth IEEE SEMI-THERM Symposium, 2000, pp. 68-75.