Electrical and thermal modelling of QFN packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 352-356

  Lu, A C W ^a   Xie, D J ^a   Shi, Z F ^a   Ryu, W ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Bonding; Chip scale packaging; Electromagnetic fields; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Silicon; Space exploration; Space technology; Wire

Indexed keywords

BONDING; ELECTROMAGNETIC FIELDS; INTEGRATED CIRCUIT INTERCONNECTS; SILICON; SPACE RESEARCH; WIRE; WIRELESS TELECOMMUNICATION SYSTEMS;

CHIP-SCALE PACKAGING; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; INTEGRATED CIRCUIT INTERCONNECTIONS; SPACE EXPLORATIONS; SPACE TECHNOLOGIES;

ELECTRONICS PACKAGING;

EID: 84949550932     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906399     Document Type: Conference Paper

References (5)

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2. Tsai, C.T., "Package inductance characterization at high frequencies", IEEE Trans-CPMT-B, Vol. 17, No. 3 (1994), pp. 175-181.
3. th Electronic Components and Technology Conf, May. 1997, pp. 1087-1093.
4. Jeong, J. et al. "Electrical Characterization of Ball Grid Array Packages", IEEE Trans-CPMT-B, Vol. 22, No. 3 (1999), pp. 343-347.
5. th Electronic Components and Technology Conf, May. 2000