Thermal characterization of cavity-down TBGA package with flotherm simulation

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2000, Pages 68-75

  Cho, Eric ^a   Tan, Eric ^b   Lin, Yur Tsai ^c  

^a Flotrend Co   (Taiwan)

^b Taiwan Semiconductor Technology Co   (Taiwan)

^c YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE VOLUME METHOD; HEAT LOSSES; SEMICONDUCTOR DEVICE MANUFACTURE;

TAPE BALL GRID ARRAY (TBGA);

ELECTRONICS PACKAGING;

EID: 0033750112     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2000.837063     Document Type: Article

References (5)

1. B. M. Guenin Packaging: Design for Thermal Performance Electronics Cooling 3 2 14 19 1997
2. H. Roland Electronic Packaging & Prosuction 1996 Universal Instrument Corp. N.Y., Binghamton Trends in Microelectronic Packaging
3. Integrated Circuits Thermal Test Method Environmental Conditions-Natural Convection (Still-Air) EIA/JESD 51-2
4. Thermal Test Method Environmental Conditions-Forced Convection JESD 51-6 Electronic Industries Association
5. Flotherm Reference and User Manuals 1995 Flomerics limited