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Journal of Electronic Materials

Volumn 37, Issue 3, 2008, Pages 339-346

Energy-based micromechanics analysis on fatigue crack propagation behavior in Sn-Ag eutectic solder

(4) Yao, Yao a Vaynman, Semyon a Keer, Leon M a Fine, Morris E a

a Northwestern University (United States)

Author keywords

Crack propagation; Fatigue; Finite element; Phase transformation; Sn Ag solder; Unified creep and plasticity theory

Indexed keywords

EUTECTIC SOLDERS; PLASTICITY THEORY; SN-AG EUTECTIC SOLDER;

EUTECTICS; FINITE ELEMENT METHOD; PHASE TRANSITIONS; PLASTICITY;

FATIGUE CRACK PROPAGATION;

EID: 38349143741 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-007-0356-5 Document Type: Article

Times cited : (11)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.