메뉴 건너뛰기




Volumn 42, Issue 2, 2008, Pages 173-187

Thermal properties of heat conductive silicone rubber filled with hybrid fillers

Author keywords

CTE; Silicone carbide whisker; Silicone nitride; Silicone rubber; Thermal conductivity

Indexed keywords

FILLERS; NITRIDES; SILICON; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

EID: 37849036863     PISSN: 00219983     EISSN: 1530793X     Source Type: Journal    
DOI: 10.1177/0021998307086184     Document Type: Article
Times cited : (87)

References (32)
  • 1
    • 17744375578 scopus 로고    scopus 로고
    • Thermal Characterization of Al2O3 and ZnO Reinforced Silicone Rubber as Thermal Pads for Heat Dissipation Purposes
    • Sim, L.C. and Ramanan, S.L. (2005). Thermal Characterization of Al2O3 and ZnO Reinforced Silicone Rubber as Thermal Pads for Heat Dissipation Purposes, Thermochimia Acta, 430 (1 - 2). 155 - 165.
    • (2005) Thermochimia Acta , vol.430 , Issue.2 , pp. 155-165
    • Sim, L.C.1    Ramanan, S.L.2
  • 2
    • 0042236580 scopus 로고    scopus 로고
    • The Electrical and Thermal Conductivity of Woven Pristine and Intercalated Graphite Fiber-Polymer Composites
    • James, R.G. and Yvonne, Y.V. (2003). The Electrical and Thermal Conductivity of Woven Pristine and Intercalated Graphite Fiber-Polymer Composites, Carbon, 41 (3). 2187 - 2193.
    • (2003) Carbon , vol.41 , Issue.3 , pp. 2187-2193
    • James, R.G.1    Yvonne, Y.V.2
  • 3
    • 0034107550 scopus 로고    scopus 로고
    • Thermal Conductivity of AlN/Polystyrene Interpenetrating Networks
    • Giuseppe, P. and Ikuko, K. (2000). Thermal Conductivity of AlN/Polystyrene Interpenetrating Networks, Journal of European Ceramics Society, 20 (8). 1197 - 1203.
    • (2000) Journal of European Ceramics Society , vol.20 , Issue.8 , pp. 1197-1203
    • Giuseppe, P.1    Ikuko, K.2
  • 4
    • 34147203243 scopus 로고    scopus 로고
    • Study on Novel Heat Conductive Composite Silicone Rubbe, Journal of Applied
    • Zhou,W.Y. and Qi, S.H. (2007). Study on Novel Heat Conductive Composite Silicone Rubbe, Journal of Applied Polymer Science, 104 (4). 2478 - 2483.
    • (2007) Polymer Science , vol.104 , Issue.4 , pp. 2478-2483
    • Zhou, W.Y.1    Qi, S.H.2
  • 5
    • 34748831384 scopus 로고
    • Thermal Conductivity of Boron Carbide-Boron Nitride Composites
    • Ruth, R. and Donaldson, K.Y. (1992). Thermal Conductivity of Boron Carbide-Boron Nitride Composites, Journal of America Ceramics Society, 75 (2). 2887 - 2890.
    • (1992) Journal of America Ceramics Society , vol.75 , Issue.2 , pp. 2887-2890
    • Ruth, R.1    Donaldson, K.Y.2
  • 6
    • 0037212964 scopus 로고    scopus 로고
    • Thermal Conductivity of Particle Filled Polyethylene Composite Materials, Composites
    • Kumlutas, D., Ismail, H. and Tavman, M. (2003). Thermal Conductivity of Particle Filled Polyethylene Composite Materials, Composites Science and Technology, 63 (1). 113 - 117.
    • (2003) Science and Technology , vol.63 , Issue.1 , pp. 113-117
    • Kumlutas, D.1    Ismail, H.2    Tavman, M.3
  • 7
    • 0012838245 scopus 로고    scopus 로고
    • Orientation Specific Thermal Properties of Polyimide Film, Journal of Electronic Packaging
    • Samuels, R.J. and Mathis, N.E. (2001). Orientation Specific Thermal Properties of Polyimide Film, Journal of Electronic Packaging, Transactions of the ASME, 123 (3). 273 - 277.
    • (2001) Transactions of the ASME , vol.123 , Issue.3 , pp. 273-277
    • Samuels, R.J.1    Mathis, N.E.2
  • 8
    • 0001557266 scopus 로고    scopus 로고
    • Very High Thermal Conductivity Obtained by Boron Nitride-Filled Polybenzoxazine
    • Ishida, H. and Rimdusit, S. (1998). Very High Thermal Conductivity Obtained by Boron Nitride-Filled Polybenzoxazine, Thermochimica Acta, 320 (5). 177 - 186.
    • (1998) Thermochimica Acta , vol.320 , Issue.5 , pp. 177-186
    • Ishida, H.1    Rimdusit, S.2
  • 9
    • 0141637221 scopus 로고    scopus 로고
    • Carbon Black Dispersion as Thermal Pastes That Surpass Solder in Providing High Thermal Contact Conductance
    • Leong, C.K. and Chung, D.D.L. (2003). Carbon Black Dispersion as Thermal Pastes That Surpass Solder in Providing High Thermal Contact Conductance, Carbon, 41 (13). 2459 - 2469.
    • (2003) Carbon , vol.41 , Issue.13 , pp. 2459-2469
    • Leong, C.K.1    Chung, D.D.L.2
  • 10
    • 13844255699 scopus 로고    scopus 로고
    • Evaluation for Scale Structures Fabricated using Epoxy- Aluminum Particle Composite and Its Application. Journal of Materials
    • Chung, S. and Im, Y.G. (2005). Evaluation for Scale Structures Fabricated using Epoxy- Aluminum Particle Composite and Its Application. Journal of Materials Processing Technology, 160 (2). 168 - 173.
    • (2005) Processing Technology , vol.160 , Issue.2 , pp. 168-173
    • Chung, S.1    Im, Y.G.2
  • 11
    • 0038077171 scopus 로고    scopus 로고
    • Dielectric Properties of Matrix Composite Materials with High Volume Concentrations of Inclusions
    • Kanaun, S.K. (2003). Dielectric Properties of Matrix Composite Materials with High Volume Concentrations of Inclusions, International Journal of Engineering Science, 41 (12). 1287 - 1312.
    • (2003) International Journal of Engineering Science , vol.41 , Issue.12 , pp. 1287-1312
    • Kanaun, S.K.1
  • 12
    • 2342507648 scopus 로고    scopus 로고
    • Measurement of Thermal Conductivity for Fiber-Reinforced Composites
    • Sweeting, R.D. and Liu, X.L. (2004). Measurement of Thermal Conductivity for Fiber-Reinforced Composites, Composites: Part A, 35 (7 - 8). 933 - 938.
    • (2004) Composites , vol.35 , Issue.8 , pp. 933-938
    • Sweeting, R.D.1    Liu, X.L.2
  • 13
    • 0033678411 scopus 로고    scopus 로고
    • Thermal Modeling and Experimental Validation of Thermal Interface Performance between Non Flat Surfaces
    • Chiu, C.P. and Solbrekken, G.L. (2000). Thermal Modeling and Experimental Validation of Thermal Interface Performance Between Non Flat Surfaces. In: Proceedings of the Inter Society Conference on Thermal Phenomena, Las Vegas, NV, USA, May 23-26, pp. 55-62.
    • Proceedings of the Inter Society Conference on Thermal Phenomena
    • Chiu, C.P.1    Solbrekken, G.L.2
  • 14
    • 37849000234 scopus 로고    scopus 로고
    • Preparation and the Properties of PMR-type Polymide Composites with Aluminum Nitride, Journal of Applied
    • Wang, J.J. and Yi, X.S. (2003). Preparation and the Properties of PMR-type Polymide Composites with Aluminum Nitride, Journal of Applied Polymer Science, 89 (4). 1623 - 1628.
    • (2003) Polymer Science , vol.89 , Issue.4 , pp. 1623-1628
    • Wang, J.J.1    Yi, X.S.2
  • 15
    • 0033694254 scopus 로고    scopus 로고
    • Percolation Theory Applied to the Analysis of Thermal Interface Materials in Flip-Chip Technology
    • Devpura, A. and Phelan, P.E. (2000). Percolation Theory Applied to the Analysis of Thermal Interface Materials in Flip-Chip Technology, In: Proceedings of the Inter Society Conference on Thermal Phenomena, Las Vegas, NV, USA, May 23-26, pp. 21-28.
    • Proceedings of the Inter Society Conference on Thermal Phenomena
    • Devpura, A.1    Phelan, P.E.2
  • 16
    • 3843150403 scopus 로고    scopus 로고
    • Preparation and Properties of Polyimide/Aluminum Nitride Composites
    • Xie, S.H., Zhu, B.K. and Li, J.B. (2004). Preparation and Properties of Polyimide/Aluminum Nitride Composites, Polymer Testing, 23 (7). 797 - 801.
    • (2004) Polymer Testing , vol.23 , Issue.7 , pp. 797-801
    • Xie, S.H.1    Zhu, B.K.2    Li, J.B.3
  • 17
    • 2442695718 scopus 로고    scopus 로고
    • Effects of Interfacial Thermal Barrier Resistance and Particle Shape and Size on the Thermal Conductivity of AlN/PI Composites, Composites
    • Wang, J.J. and Yi, X.S. (2004). Effects of Interfacial Thermal Barrier Resistance and Particle Shape and Size on the Thermal Conductivity of AlN/PI Composites, Composites Science and Technology, 64 (10 - 11). 1623 - 1628.
    • (2004) Science and Technology , vol.64 , Issue.11 , pp. 1623-1628
    • Wang, J.J.1    Yi, X.S.2
  • 18
    • 33845314800 scopus 로고    scopus 로고
    • Thermal Conductivities of Composites in Several Types of Dispersion System, Journal of Applied
    • Agari, Y. and Ueda, A. (1997). Thermal Conductivities of Composites in Several Types of Dispersion System, Journal of Applied Polymer Science, 65: 2732 - 2738.
    • (1997) Polymer Science , vol.65 , pp. 2732-2738
    • Agari, Y.1    Ueda, A.2
  • 19
    • 0034648253 scopus 로고    scopus 로고
    • Thermal Characterization of an Epoxy-Based Underfill Material for Flip Chip Packaging
    • He, Y. and Moreira, B.E. (2000). Thermal Characterization of an Epoxy-Based Underfill Material for Flip Chip Packaging, Thermochimica Acta, 357 (4). 1 - 8.
    • (2000) Thermochimica Acta , vol.357 , Issue.4 , pp. 1-8
    • He, Y.1    Moreira, B.E.2
  • 20
    • 0033878862 scopus 로고    scopus 로고
    • Laser Abalation Machining of Metal/Polymer Composite Materials, Applied
    • Slocombe, A. and Li, L. (2000). Laser Abalation Machining of Metal/Polymer Composite Materials, Applied Surface Science, 154 - 155 (3). 617 - 621.
    • (2000) Surface Science , vol.155 , Issue.3 , pp. 617-621
    • Slocombe, A.1    Li, L.2
  • 21
    • 0035546301 scopus 로고    scopus 로고
    • Thermally Conducting Aluminum Nitride Polymer-Matrix Composites
    • Xu, Y.S. and Chung, D.D. (2001). Thermally Conducting Aluminum Nitride Polymer-Matrix Composites, Composites, Part A, 32 (12). 1749 - 1757.
    • (2001) Composites , vol.32 , Issue.12 , pp. 1749-1757
    • Xu, Y.S.1    Chung, D.D.2
  • 22
    • 0037704923 scopus 로고    scopus 로고
    • Highly Thermally Conductive Room-Temperature-Vulcanized Silicone Rubber and Silicone Grease, Journal of Applied
    • Wang, Q. and Xie, Z.M. (2003). Highly Thermally Conductive Room-Temperature-Vulcanized Silicone Rubber And Silicone Grease, Journal of Applied Polymer Science, 89 (9). 2397 - 2399.
    • (2003) Polymer Science , vol.89 , Issue.9 , pp. 2397-2399
    • Wang, Q.1    Xie, Z.M.2
  • 23
    • 33947640663 scopus 로고    scopus 로고
    • Effect of Particle Size of Al2O 3 on the Properties of Filled Thermally Conductive Silicone Rubber
    • Zhou,W.Y. and Qi, S.H. (2007). Effect of Particle Size of Al2O 3 on the Properties of Filled Thermally Conductive Silicone Rubber, Journal of Applied Polymer Science, 104 (2). 1312 - 1318.
    • (2007) Journal of Applied Polymer Science , vol.104 , Issue.2 , pp. 1312-1318
    • Zhou, W.Y.1    Qi, S.H.2
  • 24
    • 0035474977 scopus 로고    scopus 로고
    • Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials, Journal of Heat Transfer
    • Prasher, R.S. (2001). Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials, Journal of Heat Transfer, Transactions ASME, 123 (5). 969 - 975.
    • (2001) Transactions ASME , vol.123 , Issue.5 , pp. 969-975
    • Prasher, R.S.1
  • 25
    • 27344456347 scopus 로고    scopus 로고
    • Fabrication of Aligned Carbon Nanotube-Filled Rubber Composite
    • Kim, Y.A. and Hayashi, T. (2006). Fabrication of Aligned Carbon Nanotube-Filled Rubber Composite, Scripta Materialia, 54 (1). 31 - 35.
    • (2006) Scripta Materialia , vol.54 , Issue.1 , pp. 31-35
    • Kim, Y.A.1    Hayashi, T.2
  • 26
    • 0031143265 scopus 로고    scopus 로고
    • Effect Thermal Conductivity of Particulate Composites with Interfacial Thermal Resistance, Journal of
    • Nan, C.W. and Birringer, R. (1997). Effect Thermal Conductivity of Particulate Composites with Interfacial Thermal Resistance, Journal of Applied Physics, 81 (10). 6692 - 6699.
    • (1997) Applied Physics , vol.81 , Issue.10 , pp. 6692-6699
    • Nan, C.W.1    Birringer, R.2
  • 27
    • 0023365636 scopus 로고
    • Effective Thermal Conductivity of Composite with Interfacial Thermal Barrier Resistance
    • Hasselman, P.H. and Lloyd, F.J. (1987). Effective Thermal Conductivity of Composite with Interfacial Thermal Barrier Resistance, Journal of Composites Materials, 21 (6). 508 - 515.
    • (1987) Journal of Composites Materials , vol.21 , Issue.6 , pp. 508-515
    • Hasselman, P.H.1    Lloyd, F.J.2
  • 28
    • 33750030511 scopus 로고    scopus 로고
    • Properties of Thermal Conductive Silicone Rubber Filled Hybrid Fillers, Chinese
    • Zhou,W.Y. and Qi, S.H. (2005). Properties of Thermal Conductive Silicone Rubber Filled Hybrid Fillers, Chinese Journal of Materials Engineering, (8). 15 - 17.
    • (2005) Journal of Materials Engineering , Issue.8 , pp. 15-17
    • Zhou, W.Y.1    Qi, S.H.2
  • 29
    • 33751190976 scopus 로고    scopus 로고
    • Enhanced Thermal Conductivity of Polymer Composites Filled with Hybrid Filler
    • Lee, G.W. and Min, P. (2006). Enhanced Thermal Conductivity of Polymer Composites Filled with Hybrid Filler, Composites, Part A, 37 (5). 727 - 734.
    • (2006) Composites , vol.37 , Issue.5 , pp. 727-734
    • Lee, G.W.1    Min, P.2
  • 30
    • 0036669992 scopus 로고    scopus 로고
    • Thermal and Electrical Properties of Magnetite Filled Polymers
    • Weidenfeller, B. and Hofer, M. (2002). Thermal and Electrical Properties of Magnetite Filled Polymers, Composites: Part A, 33 (8). 1041 - 1053.
    • (2002) Composites , vol.33 , Issue.8 , pp. 1041-1053
    • Weidenfeller, B.1    Hofer, M.2
  • 31
    • 0029237345 scopus 로고
    • Thermal Properties of Ceramic-Loaded Conductive Butyl Rubber Composites
    • Nasr, G.R. and Badawy, M.M. (1995). Thermal Properties of Ceramic-Loaded Conductive Butyl Rubber Composites, Polymer Degradation and Stability, 47 (3). 391 - 395.
    • (1995) Polymer Degradation and Stability , vol.47 , Issue.3 , pp. 391-395
    • Nasr, G.R.1    Badawy, M.M.2
  • 32
    • 0032215976 scopus 로고    scopus 로고
    • Effective Thermal Conductivity of thin Randomly Oriented Composite Material, Journal of Heat Transfer
    • Phelan, P.E. and Niemann, R.C. (1998). Effective Thermal Conductivity of thin Randomly Oriented Composite Material, Journal of Heat Transfer, Transactions ASME, 120 (4). 971 - 976.
    • (1998) Transactions ASME , vol.120 , Issue.4 , pp. 971-976
    • Phelan, P.E.1    Niemann, R.C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.