Thermal modeling and experimental validation of thermal interface performance between non-flat surfaces

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 55-62

  Chiu, Chia Pin ^a   Solbrekken, Gary L ^a   Young, Todd M ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; COOLING; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; THERMAL CONDUCTIVITY;

ALUMINUM NITRIDE; INTEGRATED HEAT SPREADER; THERMAL GREASE; THERMAL INTERFACE MATERIALS;

ELECTRONICS PACKAGING;

EID: 0033678411     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)