Evaluation for micro scale structures fabricated using epoxy-aluminum particle composite and its application

Journal of Materials Processing Technology

Volumn 160, Issue 2, 2005, Pages 168-173

  Chung, Sungil ^a   Im, Yonggwan ^a   Kim, Hoyoun ^b   Park, Sunjoon ^a   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Dimension accuracy; Epoxy aluminum particle composite; Hardness; Microgear; Thermal conductivity

Indexed keywords

COMPOSITE MATERIALS; HARDNESS; PARTICLE SIZE ANALYSIS; POLYMERS; SILICONES; THERMAL CONDUCTIVITY;

DIMENSION ACCURACY; EPOXY-ALUMINUM PARTICLE COMPOSITES; MICROGEARS;

ALUMINUM;

EID: 13844255699     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2004.06.004     Document Type: Article

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