A comparison of hourly versus daily testing methods for evaluating the reliability of water soluble fluxes

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 285-292

  Ready, W Jud ^a   Turbini, Laura J ^b  

^a Georgia Institute of Technology   (United States)

^b International Reliability Consultant   (United States)

Author keywords

Conductive anodic filament (cap); Dendrites; Electrochemical migration; Hot air solder leveling (hasl) fluids; Surface insulation resistance (sir); Water soluble flux

Indexed keywords

ELECTRIC RESISTANCE; ELECTROCHEMISTRY; ENVIRONMENTAL TESTING; FAILURE ANALYSIS; FLUXES; RELIABILITY;

CONDUCTIVE ANODIC FILAMENT; ELECTRICAL RELIABILITY TESTING; ELECTROCHEMICAL MIGRATION; HOT AIR SOLDER LEVELING FLUIDS; SURFACE INSULATION RESISTANCE; WATER SOLUBLE FLUX;

PRINTED CIRCUIT TESTING;

EID: 0033723534     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846647     Document Type: Article

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