Evaluation of the reliability and corrosivity of VOC-free, no-clean fluxes using standard, modified and electrochemical methods

Soldering and Surface Mount Technology

Volumn , Issue 22, 1996, Pages 6-9

  Ramirez, C ^a   Lei, K S ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COPPER CORROSION; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; POLARIZATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; SOLDERING; VOLATILE ORGANIC COMPOUNDS;

COPPER MIRROR TESTING; CORROSION TESTING; CORROSIVITY; ELECTROCHEMICAL POLARIZATION MEASUREMENT; FLUX QUALIFICATION TESTS; MODIFIED RELIABILITY TESTS; NO CLEAN FLUXES; PRINTED CIRCUIT ASSEMBLY; SURFACE INSULATION RESISTANCE;

FLUXES;

EID: 0030086137     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (10)

1. Schneider, A., Proceedings Nepcon West '94, pp. 1444-1451, March (1994).
2. Fremd, E. and Ivankovits, J., Proceedings Nepcon West '94, pp. 1456-1480, March (1994).
3. Walker, M. and Thompson, V., Proceedings Nepcon West '94, pp. 1481-1492, March (1994).
4. Ramirez, C. and Lei, K.-S., Compaq Computer Corporation internal report (1993).
5. Sohn, J., Proceedings Nepcon West '93, pp. 1325-1331, March (1993).
6. Lei, K.-S. and Ramirez, C., Proceedings Nepcon West '94, pp. 396-405, March (1994).
7. 'Corrosion Engineering', edited by M. G. Fontana, 3rd Edition, McGraw-Hill (1986).
8. 'Electrochemical Techniques for Corrosion Engineering', edited by R. Baboian, National Association of Corrosion Engineers, Houston (1986).
9. Lei, K.-S., Ramirez, C., Petrucci, M., Jones, E. and Kargol, J., Proceedings Nepcon West '92, pp. 619-632, February (1992).
10. CRC Handbook, 65th Edition, CRC Press, p. C-687 (1984-85).