GaAs-wafer dicing using the water jet guided laser

2005 International Conference on Compound Semiconductor Manufacturing Technology

Volumn , Issue , 2005, Pages

  Perrottet, Delphine ^a   Spiegel, Akos ^a   Amorosi, Simone ^a   Richerzhagen, Bernold ^a  

^a Synova SA   (Switzerland)

Author keywords

Compound semiconductors; Edge grinding; GaAs; Laser cutting; Thin wafer dicing; Water jet guided laser

Indexed keywords

COMPOUND SEMICONDUCTORS; EDGE GRINDING; GAAS; LASER CUTTING; THIN WAFER DICING; WATER JET GUIDED LASERS;

CRACKS; CUTTING EQUIPMENT; FAILURE (MECHANICAL); GALLIUM ARSENIDE; GRINDING (MACHINING); JETS; SEMICONDUCTING GALLIUM; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR LASERS; TECHNOLOGY; TOXIC MATERIALS;

SILICON WAFERS;

EID: 84887393718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. N. Dushkina, Dicing GaAs wafers, Industrial Laser Solutions, June 2003.
2. O. Sibailly, F. Wagner, B. Richerzhagen, Laser-Edge Grinding of Thin Wafers with the Water-Jet-Guided Laser, Future Fab International 16, February 2004.