Removable fast package technology for MEMS devices using polymer connectors and silicon sockets

Journal of Micromechanics and Microengineering

Volumn 17, Issue 12, 2007, Pages 2461-2468

  Lin, Chia Min ^a   Chen, Wen Chih ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; HYDROPHOBICITY;

MICROFABRICATION PROCESSES; SILICON SOCKETS;

MEMS;

EID: 36949010569     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/12/011     Document Type: Article

References (12)

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