New microstructure-related em degradation and failure mechanisms in Cu interconnects with CoWP coating

AIP Conference Proceedings

Volumn 945, Issue , 2007, Pages 107-114

  Meyer, Moritz Andreas ^a   Zschech, Ehrenfried ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 36849010825     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2815770     Document Type: Conference Paper

References (11)

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4. M.A. Meyer et al, Microelectronics Engineering 64, 375 (2002).
5. E. Zschech et al., MRS Proceedings, 812, 2004, pp. 361-372.
6. C.K. Hu et al., Appl. Phys. Lett. 81, 1782 (2002).
7. C.K. Hu et al., Microelectronic Engineering 70, 406 (2003).
8. M.W. Lane et al., Appl. Phys. Lett. 93, 1417 (2003).
9. M.W. Lane et al., Mater. Res. Soc. Proc. 766, 153-164 (2003).
10. E. Zschech et al., Z. Metallkde. 96, 966-971 (2005).
11. C.K. Hu et al., Proc. International Interconnect Technoloy Conference (IITC) 2007, pp. 93.