Investigation of the influence of the local microstructure of copper interconnects on void formation and evolution during electromigration testing

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 175-184

  Meyer, M A ^a   Grafe, M ^a,b   Engelmann, H J ^a   Langer, E ^a   Zschech, E ^a  

^a IBM MICROELECTRONICS   (United States)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Alloy; Copper; EBSD; Electromigration; In situ; Microstructure

Indexed keywords

EID: 33751230793     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173547     Document Type: Conference Paper

References (7)

1. M. A. Meyer, M. Herrmann, E. Langer, E. Zschech, Microelectronics Engineering 64, 375 (2002).
2. M. A. Meyer, M. Grafe, H.-J. Engelmann, E. Zschech, MAM2004 conference, Brussels (2004).
3. E. Zschech, H. J. Engelmann, M. A. Meyer, V. Kahlert, A. V. Vairagar, S. G. Mhaisalkar, A. Krishnamoorthy, M. Y. Yan, K. N. Tu, V. Sukharev, Z. Metallkunde 96 (2005) 996.
4. A. V. Vairagar, S. G. Mhaisalkar, M. A. Meyer, E. Zschech, A. Krishnamoorthy, Microelectronics Engineering (2005) (in press).
5. C. K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Domenicucci, X. Chen, A. K. Stamper, Appl. Phys. Lett. 81, 1782 (2002)
6. th International Workshop", AIP Conference Proceedings, this volume
7. E. Zschech, H. Geisler, I. Zienert, H. Prinz, E. Langer, M. A. Meyer, G. Schneider, Proc. of the Advanced Metallization Conference, San Diego, 305-311 (2002)