Wire bond reliability for power electronic modules - Effect of bonding temperature

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Loh, Wei Sun ^a   Corfield, Martin ^a   Lu, Hua ^b   Hogg, Simon ^c   Tilford, Tim ^b   Mark Johnson, C ^d  

^a UNIVERSITY OF SHEFFIELD   (United Kingdom)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

^c LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^d UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TEMPERATURE; PLASTIC STRAIN ENERGY; ROOM TEMPERATURE; WIRE BOND RELIABILITY;

GRAIN BOUNDARIES; MICROSTRUCTURE; RESIDUAL STRESSES; SILICON; THERMAL CYCLING;

POWER ELECTRONICS;

EID: 36348984993     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360057     Document Type: Conference Paper

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