-
1
-
-
28344452134
-
Demystifying 3d ics: The pros and cons of going vertical
-
Nov-Dec
-
W. Davis, J. Wilson, S. Mick, J. Xu, H. Hua, C. Mineo, A. Sule, M. Steer, and P. Franzon, "Demystifying 3d ics: The pros and cons of going vertical," Design and Test of Computers, pp. 498-510, Nov-Dec 2005.
-
(2005)
Design and Test of Computers
, pp. 498-510
-
-
Davis, W.1
Wilson, J.2
Mick, S.3
Xu, J.4
Hua, H.5
Mineo, C.6
Sule, A.7
Steer, M.8
Franzon, P.9
-
2
-
-
2942639675
-
Technology, performance, and computer-aided design of three-dimensional integrated circuits
-
New York, NY, USA: ACM Press
-
S. Das, A. Fan, K.-N. Chen, C. S. Tan, N. Checka, and R. Reif, "Technology, performance, and computer-aided design of three-dimensional integrated circuits," in ISPD '04: Proceedings of the 2004 international symposium on Physical design. New York, NY, USA: ACM Press, 2004, pp. 108-115.
-
(2004)
ISPD '04: Proceedings of the 2004 international symposium on Physical design
, pp. 108-115
-
-
Das, S.1
Fan, A.2
Chen, K.-N.3
Tan, C.S.4
Checka, N.5
Reif, R.6
-
4
-
-
0347409236
-
Efficient thermal placement of standard cells in 3d ics using a force directed approach
-
Washington, DC, USA: IEEE Computer Society
-
B. Goplen and S. Sapatnekar, "Efficient thermal placement of standard cells in 3d ics using a force directed approach," in ICCAD '03: Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design. Washington, DC, USA: IEEE Computer Society, 2003, p. 86.
-
(2003)
ICCAD '03: Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
, pp. 86
-
-
Goplen, B.1
Sapatnekar, S.2
-
6
-
-
33751410351
-
Thermal via planning for 3-d ics
-
Washington, DC, USA: IEEE Computer Society
-
J. Cong and Y. Zhang, "Thermal via planning for 3-d ics," in ICCAD '05: Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design. Washington, DC, USA: IEEE Computer Society, 2005, pp. 745-752.
-
(2005)
ICCAD '05: Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
, pp. 745-752
-
-
Cong, J.1
Zhang, Y.2
-
7
-
-
0034819418
-
Interconnect characteristics of 2.5-d system integration scheme
-
New York, NY, USA: ACM Press
-
Y. Deng and W. P. Maly, "Interconnect characteristics of 2.5-d system integration scheme," in ISPD '01: Proceedings of the 2001 international symposium on Physical design. New York, NY, USA: ACM Press, 2001, pp. 171-175.
-
(2001)
ISPD '01: Proceedings of the 2001 international symposium on Physical design
, pp. 171-175
-
-
Deng, Y.1
Maly, W.P.2
-
8
-
-
33847311439
-
3d placement algorithm considering vertical channels and guided by 2d placement solution
-
G. Liu, Z. Li, Q. Zhou, X. Hong, and H. H. Yang, "3d placement algorithm considering vertical channels and guided by 2d placement solution," in ASICON 2005: 6th International Conference On ASIC, 2005, pp. 24-27.
-
(2005)
ASICON 2005: 6th International Conference On ASIC
, pp. 24-27
-
-
Liu, G.1
Li, Z.2
Zhou, Q.3
Hong, X.4
Yang, H.H.5
-
9
-
-
36348985440
-
Wirelength reduction using 3-d physical design
-
I. Kaya, S. Salewski, M. Olbrich, and E. Barke, "Wirelength reduction using 3-d physical design," in Integrated Circuit and System Design ? Power and Timing Modeling, Optimization and Simulation; Proceedings of 14th International Workshop, PATMOS 2004, 2004.
-
(2004)
Integrated Circuit and System Design ? Power and Timing Modeling, Optimization and Simulation; Proceedings of 14th International Workshop, PATMOS 2004
-
-
Kaya, I.1
Salewski, S.2
Olbrich, M.3
Barke, E.4
-
11
-
-
33750919241
-
-
R. Hentschke, G. Flach, F. Pinto, and R. Reis, Quadratic placement for 3d circuits using z-cell shifting, 3d iterative refinement and simulated annealing, in SBCCI '06: Proceedings of the 19th annual symposium on Integrated circuits and systems design. New York, NY, USA: ACM Press, 2006, pp. 220-225.
-
R. Hentschke, G. Flach, F. Pinto, and R. Reis, "Quadratic placement for 3d circuits using z-cell shifting, 3d iterative refinement and simulated annealing," in SBCCI '06: Proceedings of the 19th annual symposium on Integrated circuits and systems design. New York, NY, USA: ACM Press, 2006, pp. 220-225.
-
-
-
-
13
-
-
29144530525
-
Fastplace: An analytical placer for mixed-mode designs
-
New York, NY, USA: ACM Press
-
N. Viswanathan, M. Pan, and C. C.-N. Chu, "Fastplace: an analytical placer for mixed-mode designs," in ISPD '05: Proceedings of the 2005 international symposium on physical design. New York, NY, USA: ACM Press, 2005, pp. 221-223.
-
(2005)
ISPD '05: Proceedings of the 2005 international symposium on physical design
, pp. 221-223
-
-
Viswanathan, N.1
Pan, M.2
Chu, C.C.-N.3
-
14
-
-
0030644939
-
Quadratic placement revisited
-
New York, NY, USA: ACM Press
-
C. J. Alpert, T. Chan, D. J.-H. Huang, I. Markov, and K. Yan, "Quadratic placement revisited," in DAC '97: Proceedings of the 34th annual conference on Design automation. New York, NY, USA: ACM Press, 1997, pp. 752-757.
-
(1997)
DAC '97: Proceedings of the 34th annual conference on Design automation
, pp. 752-757
-
-
Alpert, C.J.1
Chan, T.2
Huang, D.J.-H.3
Markov, I.4
Yan, K.5
|