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Volumn , Issue , 2006, Pages 128-133

An algorithm for I/O partitioning targeting 3D circuits and its impact on 3D-vias

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BOOLEAN FUNCTIONS; FOOD PRESERVATION; INTEGRATED CIRCUITS; LSI CIRCUITS; PROGRAMMABLE LOGIC CONTROLLERS;

EID: 46249104007     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VLSISOC.2006.313216     Document Type: Conference Paper
Times cited : (6)

References (16)
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    • C. Ababei, Y. Feng, B. Goplen, H. Mogal, T. Zhang, K. Bazargan and S. Sapatnekar. Placement and Routing in 3D Integrated Circuits. IEEE Design and Test of Computers - Special Issue on 3D Integration; pp 520-531, Nov.-Dec. 2005.
    • (2005) Integration , pp. 520-531
    • Ababei, C.1    Feng, Y.2    Goplen, B.3    Mogal, H.4    Zhang, T.5    Bazargan, K.6    Sapatnekar, S.7
  • 4
    • 33747566850 scopus 로고    scopus 로고
    • K. Banerjee and S. Souri and P. Kapur and K. Saraswat. 3D-ICs: A Novel Chip Design for Improving Deep Submicrometer Interconnect Performance and Systems on-Chip Integration. Proceedings of IEEE, 89, issue 5, 2001.
    • K. Banerjee and S. Souri and P. Kapur and K. Saraswat. 3D-ICs: A Novel Chip Design for Improving Deep Submicrometer Interconnect Performance and Systems on-Chip Integration. Proceedings of IEEE, vol 89, issue 5, 2001.
  • 6
    • 28344452134 scopus 로고    scopus 로고
    • Demystifying 3D ICs: The Pros and Cons of Going Vertical. IEEE Design and Test of Computers - Special Issue on 3D
    • Nov.-Dec
    • W. R. Davis, J. Wilson, S. Mick, J. Xu, H. Hua, C. Mineo, A. M. SuIe, M. Steer and P. D. Franzon; Demystifying 3D ICs: The Pros and Cons of Going Vertical. IEEE Design and Test of Computers - Special Issue on 3D Integration; pp 498-510, Nov.-Dec. 2005.
    • (2005) Integration , pp. 498-510
    • Davis, W.R.1    Wilson, J.2    Mick, S.3    Xu, J.4    Hua, H.5    Mineo, C.6    SuIe, A.M.7    Steer, M.8    Franzon, P.D.9
  • 7
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    • Interconnect Characteristics of 2.5-D System Integration Scheme
    • New York, NY, USA. Anais, ACM Press
    • Y Deng; W. Maly. Interconnect Characteristics of 2.5-D System Integration Scheme. In: Proceedings of the International Symposium on Physical Design, ISPD 2001, New York, NY, USA. Anais... ACM Press, 2001. p. 171-175.
    • (2001) Proceedings of the International Symposium on Physical Design, ISPD , pp. 171-175
    • Deng, Y.1    Maly, W.2
  • 8
    • 0347409236 scopus 로고    scopus 로고
    • B. Goplen; S. Sapatnekar; Efficient Thermal Placement of Standard Cells in 3D ICs usisng Forced Directed Approach. In:Proceedings of the Internation Conference on Computer Aided Design, ICCAD 2003, November, San Jose, California, USA, 2003.
    • B. Goplen; S. Sapatnekar; Efficient Thermal Placement of Standard Cells in 3D ICs usisng Forced Directed Approach. In:Proceedings of the Internation Conference on Computer Aided Design, ICCAD 2003, November, San Jose, California, USA, 2003.
  • 10
    • 46249120029 scopus 로고    scopus 로고
    • Hypergraph & Circuit Partitioning at hMetis Home Page, http://glaros.dtc.umn.edu/gkhome/views/metis/hmetis/. Access on Mar 2006.
    • Hypergraph & Circuit Partitioning at hMetis Home Page, http://glaros.dtc.umn.edu/gkhome/views/metis/hmetis/. Access on Mar 2006.
  • 11
    • 46249117388 scopus 로고    scopus 로고
    • ISPD 2004 - IBM Standard Cell Benchmarks with Pads, http://www.public. iastate.edu/~nataraj/ISPD04_Bench.html#Benchmark_Description. Access on Mar 2006.
    • ISPD 2004 - IBM Standard Cell Benchmarks with Pads, http://www.public. iastate.edu/~nataraj/ISPD04_Bench.html#Benchmark_Description. Access on Mar 2006.
  • 13
    • 0030686036 scopus 로고    scopus 로고
    • G. Karypis, R. Aggarwal, V. Kumar, and S. Shekhar. Multilevel hypergraph partitioning: Application in VLSI domain. In Proceedings of 34th Annual Conference on. Design Automation, DAC 1997, pages 526-529, 1997.
    • G. Karypis, R. Aggarwal, V. Kumar, and S. Shekhar. Multilevel hypergraph partitioning: Application in VLSI domain. In Proceedings of 34th Annual Conference on. Design Automation, DAC 1997, pages 526-529, 1997.
  • 15
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    • P. Villarrubia, CPLACE: A Standard Cell Placement program' IBM Tech. Dis. Bull.,vol32 no. 10A, pp. 341-342, Mar. 1990.
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  • 16
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    • FastPlace: Efficient Analytical Placement Using Cell Shifting, Iterative Local Refinement,and a Hybrid Net Model
    • May
    • N. Viswanathan; C.C.-N Chu. FastPlace: Efficient Analytical Placement Using Cell Shifting, Iterative Local Refinement,and a Hybrid Net Model. IEEE Transactions on CAD, Volume 24, Issue 5, pp 722-733, May 2005.
    • (2005) IEEE Transactions on CAD , vol.24 , Issue.5 , pp. 722-733
    • Viswanathan, N.1    Chu, C.C.-N.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.