Framework for developing power electronics packaging

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 1998, Pages 9-15

  Hopkins, Douglas C ^a   O Mathuna, Sean Cian ^a   Alderman, Arnold N ^a   Flannery, John ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC NETWORK TOPOLOGY; ELECTRONICS PACKAGING; PRODUCT DESIGN;

POWER ELECTRONICS PACKAGING TECHNOLOGY;

POWER ELECTRONICS;

EID: 0031655913     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)