Study of Non-Solder, Low Cost and High Performance Flip Chip QFN Package Using Ultra Thin Pd PPF

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 31-37

  Park, Se Chuel ^a   Cho, Chullae ^a   Paek, Sung Kwan ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; FLIP CHIP DEVICES; GOLD; HEAT RESISTANCE; SOLDERING ALLOYS; BONDING; CHIP SCALE PACKAGES; COPPER; ELECTRONICS PACKAGING; INDUSTRIAL ELECTRONICS; LEAD; LEAD-FREE SOLDERS; MANUFACTURE; NICKEL; SEMICONDUCTOR DEVICES; TEMPERATURE; TIN;

SEMICONDUCTOR PACKAGES;

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS;

FLIP CHIP; FLIP-CHIP INTERCONNECTION; MANUFACTURING TECHNIQUES; PRE-PLATED LEADFRAME; SEMICONDUCTOR DEVICE PACKAGING; SEMICONDUCTOR PACKAGES; THERMAL COMPRESSION BONDING; WIDE TEMPERATURE RANGES;

EID: 0141565426     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Steve Berry, Sandra Winkler,"Radio Frequency ICs Gaining; Leadframe Packages Favored", Chip Scale Review, March 2003.
2. Edward G. Combs, "Leadless Plastic Packages, Such As the DFN and QFN, Have Inspired a Renaissance in a Mature Technology", Chip Scale Review, March 2003
3. David R. McCann, SunHo Ha, "Package Characterization and Development of a Flip Chip QFN Package: fc MLF", IEEE Electronic Components and Technology Conference, pp365-371, 2002.
4. Se-chul Park et al, "Lead frame for semiconductor package and lead frame plating method", United State Patent(Patent Number : 6,150,713), Nov.21, 2000
5. Se Chuel Park, Semiconductor Monthly, Vol. 10, 2001.
6. Se Chuel Park, "The Application Result of Ultra thin Pd PPF (Green IC Packaging and Packaging Cost Innovation)", IPC/JEDEC 2nd international Conference on Lead-free Electronics Components and Assemblies, Taipei, Taiwan, December 2002.
7. Se Chuel Park, "Introduction of u-PPF, lead-free technology", HDP User Group International, Inc. Member Meeting, Munich, Germany, April 1, 2003.
8. Se Chuel Park, "Reliability test result: MSL 1 and SMD solder joint", HDP User Group International, Inc. Member Meeting, Munich, Germany, April 1, 2003.
9. http://www.icinterconnect.com/ICInterconnect/Technology/inspect.htm
10. http://www.icinterconnect.com/ICInterconnect/Technology/reflow.htm
11. http://www.asetwn.com.tw/3/36/index.html
12. T.B. Massalski, H. Okamoto, P.R. Subramanian, L. Kacprzak, Binary Allov Phase Diagrams(2nd Edition), ASM International, 1990.
13. SGTE Binary Phase Diagram Collection, in web (http://klara.met.kth.se/pd/)