Effects of nano fillers on the conductivity, adhesion strength and reliability of Isotropic Conductive Adhesives (ICAs)

Key Engineering Materials

Volumn 353-358, Issue PART 4, 2007, Pages 2879-2882

  Li, Qinghua ^a   Zhang, Jianhua ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Adhesion strength; Carbon nanotubes; Conductivity; Isotropic conductive adhesives (ICAs); Reliability; SiO2 nano particles

Indexed keywords

BOND STRENGTH (MATERIALS); CARBON NANOTUBES; ELECTRIC CONDUCTIVITY; EPOXY RESINS; FILLERS; HARDENING; SILICA; SILVER;

CONTACT AREA; HARDENERS; ISOTROPIC CONDUCTIVE ADHESIVES (ICAS); NANOFILLERS;

ADHESIVES;

EID: 36048979315     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-456-1.2879     Document Type: Conference Paper

References (10)

1. Kim HK, Shi FG: Microelectron J Vol. 32 (2001), p.315
2. M.A. Uddin, M.O. Alam, Y.C. Chan, H.P. Chan: Microelectronics Reliability Vol. 44 (2004), p. 505
3. Yi Li, C.P. Wong: Materials Science and Engineering R Vol. 51 (2006), p. 2
4. SK Kang, RS Rai, and S. Purushothaman: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A Vol. 21 (1998), p. 18
5. Aschenbrenner R, Ostmann A, Morulla G, Zakel E, Reichl H: IEEE Transactions on. Components, Packaging, and Manufacturing Technology, Part C Vol. 20 (1997), p. 96.
6. Lu D, Tong QK, Wong CP: IEEE Trans Electron Pack Manuf Vol. 22 (1999), p. 228
7. Zhang JH, Chan YC: J Electron Mater Vol. 32 (2003), p. 228
8. Y.C. Chan , D. Y. Luk: Microelectronics Reliability Vol. 42 (2002), p. 1185
9. Liang Tongxiang, Ma Wenyou, Cao Maosheng: Polymer materials science and engineering Vol. 21 (2005), p.225
10. G Davies, J. Sandstrom: Circuits Mfg (1976), p. 59