A data mining algorithm for monitoring PCB assembly quality

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 4, 2007, Pages 299-305

  Zhang, Feng ^a   Luk, Timwah ^a  

^a FAIRCHILD SEMICONDUCTOR   (United States)

Author keywords

Latent variable model; Logistic regression; Maximum likelihood (ML); Principal component analysis (PCA)

Indexed keywords

CLUSTERING ALGORITHMS; MAXIMUM LIKELIHOOD ESTIMATION; POLYCHLORINATED BIPHENYLS; PRINCIPAL COMPONENT ANALYSIS; REGRESSION ANALYSIS; SOLDERING;

ASSEMBLY QUALITY; LATENT VARIABLE MODEL; LOGISTIC REGRESSION;

DATA MINING;

EID: 35348925422     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.907576     Document Type: Article

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