On-line enhancement of the stencil printing process

Circuits Assembly

Volumn 12, Issue 3, 2001, Pages 32-36

  Barajas, Leandro ^a,c   Kamen, Edward ^a,b,c   Goldstein, Alex ^a,c  

^a CBAR ^*  (United States)

^b Sch of Elec and Comp Engineering   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038430020     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. Pan, J., et al. (1999). Critical variables of solder paste stencil printing for micro-EGA and fine pitch QFP. IEEE/CPMT International Electronics Manufacturing Technology Symposium.
2. Feldmann, K. and Sturm, J. (1994). Closed loop quality control in printed circuit assembly. IEEE Transactions on Components, Hybrids and Manufacturing Technology, Part A, Vol. 17, No. 2.
3. http://www.flll.unilinz.ac.at/pdw/fuzzy/fuzzy_set.html.